UV AND EPOXY BONDING CHARACTERIZATION
Product Requirement
- UV epoxy bond process development for high-precision optics system.
Test Parameters
- Dispenses single drops down to 10 nanoliters. Also dispenses continuous material, like for gaskets. Automated quality control, with camera system that measures the dispense path.
Hardware
- USB Microscope, autocollimator, and UV source.
Tool Operation
- Instrument was set up to capture component shift and rotation during the glue curing process.