UV AND EPOXY BONDING CHARACTERIZATION

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Product Requirement ​

• UV epoxy bond process development for high-precision optics system.

Test Parameters ​

• Dispenses single drops down to 10 nanoliters. Also dispenses continuous material, like for gaskets.  Automated quality control, with camera system that measures the dispense path.​

Hardware ​

• USB Microscope, autocollimator, and UV source.​

Tool Operation ​

• Instrument was set up to capture component shift and rotation during the glue curing process.